? by semikron 11.01.99 skiip 302 gh 061 - 257 ctv absolute maximum ratin g s symbol conditions 1) values units v isol 4) ac, 1min 2500 v t op ,t stg operating / stor. temperature -25...+85 c igbt and inverse diode v ces 600 v v cc 5) operating dc link voltage 400 v i c igbt 300 a t j 3) igbt + diode -40...+150 c i f diode 300 a i fm diode, t p < 1 ms 600 a i fsm diode, t j = 150 c, 10ms; sin 3000 a i 2 t (diode) diode, t j = 150 c, 10ms 45 kas 2 driver v s1 stabilized power supply 18 v v s2 non-stabilized power supply 30 v f smax switching frequency 20 khz dv/dt primary to secondary side 75 kv/s characteristics symbol conditions 1) min. typ. max. units igbt 11) v (br)ces driver without supply 3 v ces -- v i ces v ge = 0, t j = 25 c v ce = v ces t j = 125 c - - - 4,5 0,4 - ma ma v to t j = 125 c -- 0,94 v r t t j = 125 c -- 6,4 m w v cesat i c = 300a, t j = 125 c -- 2,9 v v cesat i c = 300a, t j = 25 c -- 2,65 v e on + e off v cc =300/400v,i c =300a t j = 125 c -- 27/38 mj c c h c per skiip, ac side - 0,8 - nf l ce top, bottom - 15 - nh inverse diode 2) v f = v ec i f = 300a; t j = 125 c -- 1,72 v v f = v ec i f = 300a t j = 25 c -- 1,75 v e on + e off i f = 300a; t j = 125 c -- 9mj v to t j = 125 c -- 0,78 v r t t j = 125 c -- 3,3 m w thermal characteristics r thjs 10) per igbt -- 0,150 k/w r thjs 10) per diode -- 0,250 k/w r thsa 6,10) p16 heatsink; see case s2 -- 44 k/kw driver i s1 supply current 15v-supply 230+230*f s /f smax +2,5*i ac /a ma i s2 supply current 24v-supply 170+180*f s /f smax +1,9*i ac /a ma t interlock-driver interlock-time 2,3 s skiippack protection i tripsc short circuit protection 375 a i triplg ground fault protection 87 a t trip over-temp. protection 115 c u dctrip 9) u dc -protection 410 v mechanical data m1 dc terminals, si units 4 - 6nm m2 ac terminals, si units 8 - 10 nm skiippack a a a a sk integrated intelligent power pack single phase bridge skiip 302 gh 061 - 257 ctv 7,9) preliminary data case s2 features short circuit protection, due to evaluation of current sensor signals isolated power supply low thermal impedance optimal thermal management with integrated heatsink pressure contact technology with increased power cycling capability, compact design low stray inductance high power, small losses over-temperature protection 1) t heatsink = 25 c, unless otherwise specified 2) cal = controlled axial lifetime technology (soft and fast) 3) without driver 4) driver input to dc link / ac output to dc link / ac output to heatsink 5) with semikron-dc link (low inductance) 6) other heatsinks on request 7) c - integrated current sensors t - temperature protection v - 15 v or 24 v power supply 9) options available for driver: u - dc link voltage sense f C fiber optic connector 10) s referenced to temperature sensor 11) npt-technology with homo- genous current-distribution
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